Ultra-high-speed CoF camera for semiconductor manufacturing
Supports high-speed semiconductor inspection and long-distance wiring. High resolution and high frame rate.
In the semiconductor manufacturing industry, as miniaturization and high density progress, there is a demand for faster and more precise inspection processes to ensure product quality. In particular, rapid image acquisition and transmission are essential to avoid missing fine defects and to prevent becoming a bottleneck in the production line. Insufficient image transmission speeds and limitations on wiring lengths can lead to increased inspection times and a higher risk of oversight. Our ultra-high-speed CoaXPress-over-Fiber series addresses these challenges with high-speed, long-distance transmission using optical fiber. 【Application Scenarios】 - Wafer inspection - Chip appearance inspection - Printed circuit board inspection - Fine defect detection 【Benefits of Implementation】 - Increased productivity through reduced inspection time - Precise defect detection with high-resolution images - Flexible layout design with long-distance wiring - Improved inspection reliability through stable image transmission
- Company：CIS corporation
- Price：Other
